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Equipment Model : | DF-3000B |
Equipment Type : | Cassette-type & Cassetteless-type |
Wafer Size : | 300mm |
Configuration : | 8~12 Baths,2~6 Robots (According to the demand) |
Megasonic /Ultrasonic | |
Bath over-temperature protection, equipped with leak protection | |
Multi-level wafer protection | |
CCSS or LCSS Supply | |
Automatic supply and support multiple concentration ratio | |
Advanced marangoni dry technology | |
Temperature control, concentration control, flow control, pressure control | |
Chemical/DIW recycle & drain | |
Reliability : | Uptime≥95% Breakage≤1/100000 |
MTBF≥650 hours MTTR≤3 hours | |
Software Control : | PC+PLC+GUI, support schedule, EAP,FDC etc |
Equipment Model: | FY-3000S |
Wafer Size: | 300mm |
Chamber: | 4~24 chambers(According to the demand) |
Vacuum or Grip | |
4~5 Dispensers,2~3 chemicals | |
Exhaust separation: Acid, Alkali, Organic drain separation etch chemical | |
E F E M : | 2 or 4 SMIF/FOUP, 1 Index robot, 1or 2 WTR |
Chemical Supply: | CCSS or LCSS Supply |
Circulation pump | |
Heating control, Concentration control, Flow control, Pressure control | |
Chemical / DIW, Drain & Recycle | |
Configuration: | Lonrizer / O3 / HD camera |
Reliability: | Uptime≥95% Breakage≤1/100000 |
MTBF≥500 hours MTTR≤3 hours | |
Software Control: | PC+PLC+GUI, support EAP, FDC etc |